The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jul. 07, 2023
Qualcomm Incorporated, San Diego, CA (US);
Mustafa Badaroglu, San Diego, CA (US);
Jihong Choi, San Diego, CA (US);
Giridhar Nallapati, San Diego, CA (US);
Sivakumar Kumarasamy, San Diego, CA (US);
Zhongze Wang, San Diego, CA (US);
Woo Tag Kang, San Diego, CA (US);
Periannan Chidambaram, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
An integrated circuit (IC) is described. The IC includes a first die having a first semiconductor layer, a first active device layer and a first back-end-of-line (BEOL) layer. The IC also includes a second die having a second semiconductor layer, a second active device layer and a second back-end-of-line (BEOL) layer, and on the first die. The IC further includes a through substrate via (TSV) extending through the first die and the second die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile