The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jul. 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
PO-Hao Tsai, Taoyuan City, TW;
PO-Yao Chuang, Hsinchu, TW;
Techi Wong, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure is provided. The package structure includes a redistribution structure and a semiconductor chip bonded to the redistribution structure. The package structure also includes an adhesive layer directly on the semiconductor chip. The redistribution structure is wider than the adhesive layer. The package structure further includes an interposer substrate bonded to the redistribution structure. A bottommost surface of the interposer substrate is spaced apart from a topmost surface of the redistribution structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile