The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Mar. 18, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Jun Shinagawa, Fremont, CA (US);

Merritt Funk, Austin, TX (US);

Barton Lane, Austin, TX (US);

Ivan Maleev, Fremont, CA (US);

Justin Moses, Austin, TX (US);

Christian Williams, Austin, TX (US);

Shyam Sridhar, Austin, TX (US);

Peter Lowell George Ventzek, Austin, TX (US);

Yohei Yamazawa, Taiwa-cho, JP;

Masashi Yamaguchi, Taiwa-cho, JP;

Hiromasa Mochiki, Taiwa-cho, JP;

Mitsunori Ohata, Taiwa-cho, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/00 (2026.01); H10P 50/24 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/23 (2026.01); H10P 50/242 (2026.01); H10P 72/06 (2026.01);
Abstract

A method of pulse scoring is provided. The method includes executing a plasma process pulsed between a first state and a second state. In-situ data measured by in-situ sensors are collected while the plasma process is being executed. The in-situ data are processed to obtain first pulse features of the first state and second pulse features of the second state. Metrology data are collected after executing the plasma process. The first pulse features, the second pulse features and the metrology data are analyzed to determine pulse scores that are interaction terms of the first pulse features and the second pulse features and have correlations above a target threshold with the metrology data in regression analysis.


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Shinagawa, Jun. (2026). System and method of pulse scoring (U.S. Patent No. 12796406). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796406

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