The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Sep. 16, 2022
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Yasutoshi Tsubota, Toyama, JP;

Kimihiko Nakatani, Toyama, JP;

Yuki Yamakado, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 8/24 (2006.01); C23C 8/36 (2006.01); C23C 8/80 (2006.01); H10P 14/60 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6546 (2026.01); C23C 8/24 (2013.01); C23C 8/36 (2013.01); C23C 8/80 (2013.01);
Abstract

A method of processing a substrate includes: (a) preparing a substrate having a nitrogen-containing film and an oxygen-containing film on a surface of the substrate; and (b) modifying a surface of the nitrogen-containing film to be nitrided by supplying an active species containing nitrogen and an active species containing hydrogen, or selectively forming hydroxyl group termination on a surface of the oxygen-containing film by supplying at least one selected from the group of an active species containing hydrogen, an active species containing hydrogen and oxygen, and an active species containing hydrogen and nitrogen.


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Tsubota, Yasutoshi. (2026). Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (U.S. Patent No. 12796356). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796356

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