The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Aug. 09, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jui-Yao Lai, Yuanlin Township, TW;

Ru-Gun Liu, Zhubei City, TW;

Sai-Hooi Yeong, Zhubei City, TW;

Yen-Ming Chen, Chu-Pei City, TW;

Yung-Sung Yen, New Taipei City, TW;

Ying-Yan Chen, Hsinchu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 30/62 (2025.01); H10D 30/69 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2026.01); H10W 20/00 (2026.01); H10W 20/20 (2026.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/0223 (2025.01); H10D 30/024 (2025.01); H10D 30/62 (2025.01); H10D 30/6219 (2025.01); H10D 62/115 (2025.01); H10D 64/021 (2025.01); H10D 64/259 (2025.01); H10D 64/512 (2025.01); H10D 84/013 (2025.01); H10D 84/0142 (2025.01); H10D 84/0147 (2025.01); H10D 84/0149 (2025.01); H10D 84/0158 (2025.01); H10W 20/069 (2026.01); H10W 20/0693 (2026.01); H10W 20/077 (2026.01); H10W 20/20 (2026.01); H10D 30/611 (2025.01); H10D 30/798 (2025.01); H10D 64/017 (2025.01); H10D 64/511 (2025.01); H10W 20/056 (2026.01);
Abstract

A semiconductor device includes a first gate structure, a second gate structure, a first source/drain structure and a second source/drain structure. The first gate structure includes a first gate electrode and a first cap insulating layer disposed on the first gate electrode. The second gate structure includes a second gate electrode and a first conductive contact layer disposed on the first gate electrode. The first source/drain structure includes a first source/drain conductive layer and a second cap insulating layer disposed over the first source/drain conductive layer. The second source/drain structure includes a second source/drain conductive layer and a second conductive contact layer disposed over the second source/drain conductive layer.


Find Patent Forward Citations

Quick Actions:

Lai, Jui-Yao. (2026). Semiconductor device and a method for fabricating the same (U.S. Patent No. 12796063). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796063

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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