The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 24, 2023
Qualcomm Incorporated, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
Joan Rey Villarba Buot, Escondido, CA (US);
Sang-Jae Lee, San Diego, CA (US);
Zhijie Wang, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A package comprising a substrate and a second integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first plurality of interconnects, and a first integrated device located at least partially in the substrate. The first integrated device is coupled to the first plurality of interconnects through a first plurality of solder interconnects. The second integrated device is coupled to the first plurality of interconnects through a second plurality of solder interconnects.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile