The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Feb. 28, 2023
International Business Machines Corporation, Armonk, NY (US);
Tsung-Sheng Kang, Ballston Lake, NY (US);
Tao Li, Slingerlands, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Daniel Charles Edelstein, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor IC device includes a super via. The super via includes a lower skip via and an upper skip via. A connecting wire may be directly between or may separate the lower skip via and the upper skip via. The upper skip via may be adequately electrically isolated from a surrounding wire by an upper liner. The lower skip via may be adequately electrically isolated from a surrounding wire by a lower liner. The super via along with the connecting wire may connect a wire in the lowest wiring level with a wire in the highest wiring level. Because of the lower liner and/or the upper liner, the super via may be utilized for wiring and routing through a backside level of the semiconductor IC device (e.g., potential or signal routing) and be utilized as a heat transfer conduit through the backside of the semiconductor IC device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile