The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Sep. 27, 2024
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Mitsuru Yoshida, Shiojiri-city, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); H10P 54/00 (2026.01); H10W 46/00 (2026.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); H10P 54/00 (2026.01); H10W 46/00 (2026.01); H10W 46/501 (2026.01);
Abstract

A test jig for testing a plurality of semiconductor devices formed on a wafer, including: a substrate having an opening extending therethrough in an up-down direction, to allow air to be injected from the opening during testing; a chamber formed to surround the opening, and being positioned lower than the substrate; and a first probe for measuring each semiconductor device, the first probe being connected to the substrate. The chamber includes: a surrounding member that surrounds the first probe, and is configured to float upward in response to the injection of the air from the opening during the testing; a support part configured to support the surrounding member before the surrounding member floats upward during the testing; and a restraining member configured to restrain the surrounding member from lowering such that the surrounding member does not contact the wafer after the injection of the air stops during the testing.


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Quick Actions:

Yoshida, Mitsuru. (2026). Test jig, testing method, and method of manufacturing semiconductor device (U.S. Patent No. 12782413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12782413

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