The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jan. 13, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chien-Ju Chao, New Taipei City, TW;

Fang-Yu Fan, Hsinchu County, TW;

Yi-Chuin Tsai, Pingtung County, TW;

Kuo-Nan Yang, Hsinchu City, TW;

Chung-Hsing Wang, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/42 (2026.01); G06F 30/394 (2020.01); H10W 20/41 (2026.01); H10W 20/43 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); G06F 30/394 (2020.01); H10W 20/427 (2026.01); H10W 20/43 (2026.01); H10W 20/435 (2026.01);
Abstract

A method of generating a power network layout is provided. A first conductive line, generated by a processor, is in a first conductive layer along a first direction. A plurality of second conductive lines, generated by a processor, is in a second conductive layer along a second direction, substantially vertical to the first direction. The second conductive lines overlap with the first conductive line. A first plurality of interlayer vias, generated by a processor, is interposed between the first conductive layer and the second conductive layer at where the second conductive lines overlapping the first conductive line. Each of the second conductive lines has a width such that a first routing track adjacent to the first conductive line is available for routing or a second routing track adjacent to one of the plurality of second conductive lines is available for routing.


Find Patent Forward Citations

Chao, Chien-Ju. (2026). Fishbone structure enhancing spacing with adjacent conductive line in power network (U.S. Patent No. 12777910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777910

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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