Systems and methods for determining a localized fluid velocity of a processing liquid dispensed on a spinning substrate by tracking movement of an induced perturbation in the processing liquid across the spinning substrate

Abstract

Systems and methods are provided to control operational parameter(s) of a spin-on process based on a localized fluid velocity of a processing liquid dispensed onto a surface of a spinning semiconductor substrate. In the present disclosure, a perturbation is introduced within a processing liquid dispensed onto the spinning semiconductor substrate. Movement of the perturbation is tracked over time, as the perturbation flows along with the processing liquid across the spinning substrate surface, to determine a localized fluid velocity of the processing liquid at one or more radial positions on the substrate surface. The localized fluid velocity is then used to control one or more operational parameters of a spin-on process.