The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Jul. 24, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming Chyi Liu, Hsinchu City, TW;

Hung-Wen Hsu, Tainan City, TW;

Min-Yung Ko, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/24 (2026.01); H01J 37/32 (2006.01); H10P 50/26 (2026.01); H10P 50/28 (2026.01); H10P 50/64 (2026.01); H10P 50/66 (2026.01); H10P 72/00 (2026.01); H10P 74/20 (2026.01);
U.S. Cl.
CPC ...
H10P 50/242 (2026.01); H01J 37/32724 (2013.01); H10P 50/267 (2026.01); H10P 50/283 (2026.01); H10P 50/287 (2026.01); H10P 50/642 (2026.01); H10P 50/667 (2026.01); H10P 72/0421 (2026.01); H10P 72/0424 (2026.01); H10P 72/0434 (2026.01); H10P 72/0602 (2026.01); H10P 72/0604 (2026.01); H10P 74/203 (2026.01); H01J 2237/334 (2013.01);
Abstract

A work piece is positioned on a work piece support, which includes a plurality of temperature control zones. A pre-etch surface topography is determined by measuring a plurality of pre-etch surface heights or thicknesses at a plurality of sites on the work piece. The plurality of sites correspond to the plurality of temperature control zones on the work piece support. At least a first zone of the temperature control zones is heated or cooled based on the measured plurality of pre-etch surface heights or thicknesses, so that the first zone has a first temperature different from a second temperature of a second zone of the temperature control zones. A dry etch is carried out while the first zone has the first temperature different from the second temperature of the second zone of the temperature control zones.


Find Patent Forward Citations

Quick Actions:

Liu, Ming. (2026). By-site-compensated etch back for local planarization/topography adjustment (U.S. Patent No. 12777857). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777857

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