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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12777855 B1

PDFFull Text
Date of Patent:
Oct. 27, 2026

Filed:

Mar. 10, 2025

Processing apparatus, processing method, method of manufacturing semiconductor device, and recording medium

Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takayuki Waseda, Toyama, JP;

Takashi Nakagawa, Toyama, JP;

Kimihiko Nakatani, Toyama, JP;

Motomu Degai, Toyama, JP;

Takao Izaki, Toyama, JP;

Yoshitomo Hashimoto, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Bret P Chen

Int. Cl.
CPC ...
H10P 14/60 (2026.01); C23C 16/04 (2006.01); C23C 16/32 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); H10P 14/692 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6512 (2026.01); C23C 16/04 (2013.01); C23C 16/325 (2013.01); C23C 16/401 (2013.01); C23C 16/45534 (2013.01); C23C 16/45544 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); H10P 14/6339 (2026.01); H10P 14/6506 (2026.01); H10P 14/6546 (2026.01); H10P 14/6922 (2026.01);
Abstract

There is provided a technique that includes: (a) modifying a surface of a first base exposed on a surface of a substrate to be terminated with a hydrocarbon group by supplying a hydrocarbon group-containing gas to the substrate having the first base and a second base exposed on the surface of the substrate; and (b) selectively forming a film on a surface of the second base by supplying an oxygen- and hydrogen-containing gas to the substrate after modifying the surface of the first base.

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Waseda, Takayuki. (2026). Processing apparatus, processing method, method of manufacturing semiconductor device, and recording medium (U.S. Patent No. 12777855). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777855

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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