The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Apr. 03, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

PO-Chin Chang, Taichung City, TW;

Li-Te Lin, Hsinchu City, TW;

Pinyen Lin, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/62 (2025.01); H10D 84/01 (2025.01); H10P 14/60 (2026.01); H10P 50/00 (2026.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/6211 (2025.01); H10D 84/0149 (2025.01); H10D 84/0158 (2025.01); H10P 14/6328 (2026.01); H10P 50/00 (2026.01); H10W 20/081 (2026.01); H10W 20/42 (2026.01);
Abstract

A semiconductor device includes a semiconductor substrate, a gate structure, a source/drain region, a source/drain contact, and a first conductive via. The gate structure is over the semiconductor substrate. The source/drain region is adjacent the gate structure. The source/drain contact is over the source/drain region. The first conductive via is over the source/drain contact. From a top view, the first conductive via has two opposite first long sides and two opposite first short sides connecting the first long sides, and the first short sides are shorter than the first long sides and more curved than the first long sides. From a cross-sectional view, the first long sides of the first conductive via have bottom segments higher than a top surface of the gate structure.


Find Patent Forward Citations

Chang, PO-Chin. (2026). Semiconductor device with elongated pattern (U.S. Patent No. 12777705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777705

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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