The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andres Ramirez Macias, Zapopan, MX;

Eric Buddrius, Hillsboro, OR (US);

Jeffory Smalley, East Olympia, WA (US);

Fernando Gonzalez Lenero, Zapopan, MX;

Francisco Javier Colorado Alonso, Zúñiga, MX;

Fatima Elias Flores, Zapopan, MX;

Rolf Laido, Sherwood, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1007 (2013.01);
Abstract

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.


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Ramirez Macias, Andres. (2026). Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages (U.S. Patent No. 12777602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12777602

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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