The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Sep. 01, 2023
Qualcomm Incorporated, San Diego, CA (US);
Aniket Patil, San Diego, CA (US);
Brigham Navaja, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A package comprising an integrated device and a metallization portion. The metallization portion comprises at least one dielectric layer and a plurality of metallization interconnects. The plurality of metallization interconnects comprise a first metallization interconnect located on a first metal layer and a second metallization interconnect located on the first metal layer. The first metallization interconnect includes a first thickness. The second metallization interconnect includes a second thickness that is different from the first thickness. The package may include a substrate and/or a bridge. The substrate may include an interposer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile