The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jul. 01, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jinman Kim, Suwon-si, KR;
Young Ha Kim, Suwon-si, KR;
Yigwon Kim, Suwon-si, KR;
Hyunjae Kang, Suwon-si, KR;
Jonggu Lee, Suwon-si, KR;
Ingu Kang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An integrated circuit device includes a first semiconductor substrate having a frontside surface and a backside surface opposite to each other, an FEOL structure on the frontside surface of the first semiconductor substrate, a first BEOL structure on the FEOL structure, a second BEOL structure on the backside surface of the first semiconductor substrate, and a second semiconductor substrate apart from the first semiconductor substrate in a vertical direction with the FEOL structure and the first BEOL structure The second semiconductor substrate is locally bonded to the first BEOL structure. The second semiconductor substrate includes a main surface facing the first BEOL structure, and the main surface of the second semiconductor substrate defines a local trench region in which trenches are defined in a regular pattern and local bonding areas bonded to the first BEOL structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile