The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Nov. 24, 2022
Applicant:

United Microelectronics Corp., Hsin-Chu City, TW;

Inventor:

PO-Yu Yang, Hsinchu City, TW;

Assignee:

UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/69 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 30/795 (2025.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 64/017 (2025.01);
Abstract

A method for fabricating semiconductor device includes the steps of first forming a shallow trench isolation (STI) in a substrate, forming a gate structure on the STI and the substrate, forming a patterned mask on the STI and the gate structure, performing an etching process to remove part of the STI for forming a first trench adjacent to one side of the gate structure and a second trench adjacent to another side of the gate structure, and then forming a contact etch stop layer (CESL) on the gate structure and into the first trench and the second trench.


Find Patent Forward Citations

Yang, PO-Yu. (2026). Semiconductor device and method for fabricating the same (U.S. Patent No. 12772504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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