logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12765390 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Dec. 23, 2020

Device-to-device communication system, packages, and package system

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tolga Acikalin, San Jose, CA (US);

Arnaud Amadjikpe, Beaverton, OR (US);

Brent R. Carlton, Portland, OR (US);

Chia-Pin Chiu, Tempe, AZ (US);

Timothy F. Cox, Palo Alto, CA (US);

Kenneth P. Foust, Beaverton, OR (US);

Bryce D. Horine, Portland, OR (US);

Telesphor Kamgaing, Chandler, AZ (US);

Renzhi Liu, Portland, OR (US);

Jason A. Mix, Portland, OR (US);

Sai Vadlamani, Chandler, AZ (US);

Tae Young Yang, Portland, OR (US);

Zhen Zhou, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:

VIERING, JENTSCHURA & PARTNER mbB

Primary Examiner:

Tucker J Wright

Int. Cl.
CPC ...
H10W 44/20 (2026.01); H01Q 1/22 (2006.01); H01Q 9/36 (2006.01); H01Q 9/42 (2006.01); H01Q 21/24 (2006.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H01Q 1/2283 (2013.01); H01Q 9/36 (2013.01); H01Q 9/42 (2013.01); H01Q 21/24 (2013.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); H10W 90/722 (2026.01); H10W 44/248 (2026.01); H10W 90/724 (2026.01);
Abstract

In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

Find Patent Forward Citations

Acikalin, Tolga. (2026). Device-to-device communication system, packages, and package system (U.S. Patent No. 12765390). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765390

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…