The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Nov. 11, 2024
Applicant:

National Tsing Hua University, Hsinchu City, TW;

Inventors:

PO-Wen Chiu, Hsinchu City, TW;

Yu-Lun Yang, Hsinchu City, TW;

Assignee:

National Tsing Hua University, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/28 (2026.01); H10D 30/01 (2025.01); H10D 30/47 (2025.01); H10D 30/67 (2025.01); H10D 62/80 (2025.01); H10P 14/20 (2026.01); H10P 14/60 (2026.01); H10P 50/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/28 (2026.01); H10D 30/01 (2025.01); H10D 30/47 (2025.01); H10D 30/481 (2025.01); H10D 30/675 (2025.01); H10D 62/881 (2025.01); H10D 62/882 (2025.01); H10D 62/883 (2025.01); H10P 14/3451 (2026.01); H10P 14/6334 (2026.01); H10P 50/00 (2026.01); H10P 50/69 (2026.01); H10P 50/695 (2026.01); H10P 50/71 (2026.01); H10P 50/73 (2026.01);
Abstract

A manufacturing method of a semiconductor device includes forming a van der Waals structure between a metal and a semiconductor. The method further includes: depositing a protective layer on a two-dimensional semiconductor layer, then patterning the protective layer and the two-dimensional semiconductor layer, forming a first electrode and a second electrode on the protective layer, and removing the protective layer completely, thereby forming a van der Waals contact structure between the first electrode and the semiconductor layer and between the second electrode and the semiconductor layer.


Find Patent Forward Citations

Chiu, PO-Wen. (2026). Semiconductor device and manufacturing method thereof (U.S. Patent No. 12765293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765293

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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