The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Feb. 06, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Kuo-Feng Huang, Hsinchu City, TW;
Bo-Hung Lin, Kaohsiung City, TW;
Harry-Haklay Chuang, Zhubei City, TW;
Kuei-Hung Shen, Hsinchu City, TW;
Ding-Shuo Wang, Hsinchu County, TW;
Yu-Jen Wang, Hsinchu City, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An integrated chip including a reference magnetic layer and a barrier layer over the reference magnetic layer. A first free magnetic layer is over the barrier layer. A second free magnetic layer is over the first free magnetic layer. A spacer layer is between the first free magnetic layer and the second free magnetic layer. The spacer layer includes magnesium and a transition metal. An atomic ratio of the magnesium to the transition metal ranges from 15% to 80%.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile