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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12761551 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Dec. 05, 2022

Method of forming patterns

Applicants:

Samsung Sdi Co., Ltd., Yongin-si, KR;

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyungrang Moon, Suwon-si, KR;

Youngkwon Kim, Suwon-si, KR;

Ryunmin Heo, Suwon-si, KR;

Minyoung Lee, Suwon-si, KR;

Minsoo Kim, Suwon-si, KR;

Kyuwon Lee, Suwon-si, KR;

Jung Min Choi, Suwon-si, KR;

Cheol Hong Park, Seoul, KR;

Moohyun Koh, Hwaseong-si, KR;

Sang Won Bae, Suwon-si, KR;

Jungah Kim, Hwaseong-si, KR;

Assignees:

Samsung SDI Co., Ltd., Yongin-si, KR;

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Womble Bond Dickinson (US) LLP

Primary Examiner:

Anca Eoff

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0042 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/325 (2013.01);
Abstract

A method of forming patterns includes coating a metal-containing resist composition on a substrate, sequentially coating two types of compositions for removing edge beads along an edge of the substrate, performing a heat-treatment including drying and heating to form a metal-containing resist film on the substrate, and exposing and developing the metal-containing resist film to form a resist pattern; or coating a metal-containing resist composition on a substrate, coating a composition for removing edge beads along an edge of the substrate, performing a heat-treatment including drying and heating to form a metal-containing resist film on the substrate, exposing the metal-containing resist film, and developing with a developing solution composition to form a resist pattern, wherein details of the two types of compositions for removing edge beads and the developing solution composition are as described in the specification.

Find Patent Forward Citations

Moon, Hyungrang. (2026). Method of forming patterns (U.S. Patent No. 12761551). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12761551

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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