The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jul. 28, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Teruhiko Moriya, Kikuchi-gun, JP;

Keisuke Hamamoto, Koshi City, JP;

Yohei Maeda, Koshi City, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/00 (2006.01); G01B 11/06 (2006.01); H10P 72/00 (2026.01); H10P 74/20 (2026.01);
U.S. Cl.
CPC ...
G01B 5/0014 (2013.01); G01B 11/06 (2013.01); H10P 72/0418 (2026.01); H10P 72/0602 (2026.01); H10P 72/0604 (2026.01); H10P 74/203 (2026.01); G01B 2210/56 (2013.01);
Abstract

A substrate thickness measuring device includes a substrate holder, a thickness measurer, a housing, a temperature measurer and a thickness corrector. The substrate holder is configured to hold a substrate. The thickness measurer is configured to measure a thickness of the substrate held by the substrate holder. The housing accommodates therein the substrate holder and at least a part of the thickness measurer. The thickness corrector is configured to correct the thickness measured by the thickness measurer. The thickness corrector performs: calculating, as a corrected thickness, a product of the thickness measured by the thickness measurer and a preset correction coefficient, and changing a setting of the correction coefficient when the temperature measured by the temperature measurer falls out of a preset allowable range.


Find Patent Forward Citations

Moriya, Teruhiko. (2026). Substrate thickness measuring device, substrate processing system, and substrate thickness measuring method (U.S. Patent No. 12761008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12761008

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