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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12757781 B1

PDFFull Text
Date of Patent:
Oct. 06, 2026

Filed:

Dec. 29, 2022

Patterned sheet muf for complex packages and methods of producing

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhixin Xie, Chandler, AZ (US);

Jung Kyu Han, Chandler, AZ (US);

Gang Duan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt P.C.

Primary Examiner:

Errol V Fernandes

Int. Cl.
CPC ...
H10W 74/10 (2026.01); G02B 6/42 (2006.01); H10W 74/01 (2026.01); H10W 74/15 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/30 (2026.01); H10W 74/00 (2026.01); H10W 74/40 (2026.01);
U.S. Cl.
CPC ...
H10W 74/121 (2026.01); G02B 6/4239 (2013.01); H10W 74/012 (2026.01); H10W 74/016 (2026.01); H10W 74/15 (2026.01); H10W 74/473 (2026.01); H10W 90/00 (2026.01); H10W 72/07252 (2026.01); H10W 72/07352 (2026.01); H10W 72/07353 (2026.01); H10W 72/221 (2026.01); H10W 72/321 (2026.01); H10W 72/332 (2026.01); H10W 72/334 (2026.01); H10W 74/00 (2026.01); H10W 74/10 (2026.01); H10W 74/40 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.

Find Patent Forward Citations

Xie, Zhixin. (2026). Patterned sheet muf for complex packages and methods of producing (U.S. Patent No. 12757781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757781

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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