The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jan. 08, 2024
United Microelectronics Corp., Hsin-Chu City, TW;
Xiao Guo, Singapore, SG;
Xingxing Chen, Singapore, SG;
Ching-Yang Wen, Singapore, SG;
Purakh Raj Verma, Singapore, SG;
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Abstract
A method for forming a semiconductor structure is disclosed. A substrate having a front surface and a rear surface is provided. A plurality of trenches extending into the substrate from the front surface of the substrate is formed. A polishing stop structure is formed at a bottom of each of the plurality of trenches. The plurality of trenches is filled with a gap-filling material layer. The rear surface of the substrate is subjected to a polishing process to remove a portion of the substrate from the rear surface until the polishing stop structure is exposed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile