The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jan. 28, 2025
Tokyo Electron Limited, Tokyo, JP;
Derek Bassett, Austin, TX (US);
Rencheng Dong, Austin, TX (US);
Amir Taghavi Nasrabadi, Austin, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of wafer processing includes loading a wafer into a processing chamber. The wafer has a top surface coated with a solvent film including a first solvent and a second solvent. Relative to a total mass of the solvent film, the first solvent is 50 wt. % or more and less than 100 wt. %, and the second solvent is more than 0 wt. % and 50 wt. % or less. The second solvent has a higher vapor pressure and a lower surface tension than the first solvent. A processing fluid is supplied into the processing chamber so that the processing fluid in the processing chamber is a supercritical fluid in which the first solvent and the second solvent dissolve to form a supercritical mixture, which removes the first solvent and the second solvent from the top surface of the wafer. The supercritical mixture is discharged from the processing chamber.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile