The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Oct. 12, 2023
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Julien Frougier, Albany, NY (US);
Oleg Gluschenkov, Tannersville, NY (US);
Oscar Van Der Straten, Guilderland Center, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Juntao Li, Cohoes, NY (US);
Min Gyu Sung, Latham, NY (US);
Chanro Park, Clifton Park, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H10D 30/01 (2025.01); H10D 30/43 (2025.01); H10D 30/62 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6735 (2025.01); H10D 30/014 (2025.01); H10D 30/024 (2025.01); H10D 30/43 (2025.01); H10D 30/62 (2025.01); H10D 30/6757 (2025.01); H10D 62/121 (2025.01); H10D 62/151 (2025.01); H10D 64/017 (2025.01); H10D 84/0128 (2025.01); H10D 84/013 (2025.01); H10D 84/0149 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/853 (2025.01);
Abstract
A method to co-integrate a metal trench cut for aggressively scaled contact tip-to-tip and wrap-around-contact formation is provided. A semiconductor device made from the method is also provided in which a metal trench cut region and wrap-around-contacts are present.