The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Dec. 09, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

H. Jim Fulford, Albany, NY (US);

Mark I. Gardner, Albany, NY (US);

Partha Mukhopadhyay, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 41/27 (2023.01); H10D 30/67 (2025.01); H10D 84/03 (2025.01); H10D 88/00 (2026.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); H10D 30/6757 (2025.01); H10D 84/038 (2025.01); H10D 88/00 (2025.01); H10D 88/01 (2025.01);
Abstract

A semiconductor device includes a stack of layers, a vertical channel structure and vertical contact structures. The stack of layers defines a sidewall surface and includes terminal layers which include source, gate and drain layers. The vertical channel structure defines an inner axis that is substantially transverse to a main surface of the stack of layers. The vertical contact structures are each configured to electrically connect to a respective terminal layer. At least two vertical contact structures are in different radial positions relative to the inner axis.


Find Patent Forward Citations

Fulford, H.. (2026). 3d semiconductor device and method of forming the same (U.S. Patent No. 12757391). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757391

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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