The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Sep. 27, 2022
Applicants:

Changxin Memory Technologies, Inc., Hefei City, CN;

Changxin Jidian (Beijing) Memory Technologies Co., Ltd., Beijing, CN;

Inventor:

Zhaohong Lv, Hefei City, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/27 (2025.01); H10D 30/01 (2025.01); H10D 30/60 (2025.01); H10D 64/68 (2025.01);
U.S. Cl.
CPC ...
H10D 64/516 (2025.01); H10D 30/0227 (2025.01); H10D 30/605 (2025.01); H10D 64/683 (2025.01); H10D 64/693 (2025.01);
Abstract

The present disclosure relates to the technical field of semiconductors, and provides a manufacturing method of a semiconductor structure and a semiconductor structure. The substrate comprises an active region, and the active region is provided with a source region of a first doping type and a drain region of the first doping type; the first dielectric layer is at least partially provided on the substrate and covers a part of the source region and/or a part of the drain region; the second dielectric layer is provided on the substrate, the first dielectric layer is connected to the second dielectric layer, and a thickness of the second dielectric layer is less than a thickness of the first dielectric layer; orthographic projection of the gate structure on the substrate covers orthographic projection of the second dielectric layer and orthographic projection of the first dielectric layer on the substrate.


Find Patent Forward Citations

Lv, Zhaohong. (2026). Manufacturing method of semiconductor structure and semiconductor structure (U.S. Patent No. 12751069). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751069

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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