The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
May. 25, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Fong-Yuan Chang, Hsinchu County, TW;
Ho Che Yu, Zhubei City, TW;
Yu-Hao Chen, Hsinchu City, TW;
Yii-Chian Lu, Taipei, TW;
Ching-Yi Lin, Zhubei City, TW;
Jyh Chwen Frank Lee, Palo Alto, CA (US);
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01); H10W 90/28 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/823 (2026.01); H10W 90/28 (2026.01); H10W 90/288 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposite the plurality of first bumps, wherein the plurality of first and second bumps are thermally and/or electrically connected, and thus enable further thermal and/or electrical connections within or comprising the semiconductor device.