The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Jul. 25, 2025
Applicant:

Etron Technology, Inc., Hsinchu, TW;

Inventors:

Chao-Chun Lu, Hsinchu, TW;

Ming-Hong Kuo, Hsinchu, TW;

Assignee:

ETRON TECHNOLOGY, INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10B 80/00 (2026.01); H10D 88/00 (2026.01); H10W 90/00 (2026.01); H10W 70/65 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10D 88/00 (2025.01); H10W 90/00 (2026.01); H10W 70/65 (2026.01); H10W 72/9445 (2026.01); H10W 72/967 (2026.01);
Abstract

An IC structure includes a first memory stack including a plurality of semiconductor die. The plurality of semiconductor memory dies horizontally separate with each other, wherein each semiconductor die includes a top surface, a bottom surface opposite to the top surface, and four sidewalls with a first sidewall, a second sidewall, a third sidewall and a fourth sidewall, and a plurality of edge pads located on the first sidewall and arranged in multiple rows or two dimensions. The area of the bottom surface or the top surface is larger than that of any sidewall. A first part of the plurality of edge pads is located within a upper portion of the first sidewall of the semiconductor die, a second part of the plurality of edge pads is located within a lower portion of the first sidewall of the semiconductor die.


Find Patent Forward Citations

Lu, Chao-Chun. (2026). 3d ic structure (U.S. Patent No. 12745405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12745405

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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