The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 08, 2024
United Microelectronics Corp., Hsinchu, TW;
Chien-Yi Lee, Hsinchu City, TW;
Tse-Pu Chen, Tainan City, TW;
Ming-Yang Peng, Hsinchu County, TW;
Sheng-Huei Dai, Taitung County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A semiconductor device includes a substrate, a shielding structure, and an inductor. The shielding structure is disposed in the substrate and includes a plurality of conductive filling layers and a plurality of high-k dielectric liner layers. The plurality of conductive filling layers are in a plurality of recesses of the substrate. The plurality of high-k dielectric liner layers are between the plurality of conductive filling layers and the substrate. The plurality of conductive filling layers are electrically connected to each other and grounded. The inductor is located above the shielding structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile