The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Aug. 16, 2023
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Joan Rey Villarba Buot, Escondido, CA (US);
Zhijie Wang, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
Sang-Jae Lee, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01);
Abstract
Disclosed are devices in which a die, such as a system-on-chip (SoC) die is attached to an interposer with a mold. Unlike convention devices, the contact area for adhesion is increased by providing vertical surfaces in addition to lateral surfaces for attachment. In so doing, possibility of delamination is decreased significantly.