The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Nov. 03, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Gentaro Goshi, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10P 70/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0404 (2026.01); H10P 70/80 (2026.01); H10P 72/0402 (2026.01); H10P 72/0408 (2026.01);
Abstract

A controller of a substrate processing apparatus executes: a first process in which a processing fluid is supplied to a processing container in a first period until a pressure in the processing container is increased and the processing fluid in the processing container reaches a supercritical state; a second process in which the processing fluid is supplied to the processing container at a flow rate larger than a flow rate of the processing fluid supplied to the first fluid ejector in the first process, in a second period; and a density adjustment process in which after ending of the first process and before starting of the second process, the density adjustment mechanism makes a difference between a density of the processing fluid present in the upstream region of a second opening/closing valve and a density of the processing fluid present in the processing container smaller than a predetermined threshold.


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