The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jan. 17, 2023
Applicant:
Winbond Electronics Corp., Taichung City, TW;
Inventors:
Pin-Han Chiu, Taichung City, TW;
Feng-Jung Chang, Taichung City, TW;
Assignee:
Winbond Electronics Corp., Taichung City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10B 12/315 (2023.02); H10B 12/02 (2023.02); H10B 12/482 (2023.02); H10W 20/435 (2026.01);
Abstract
A semiconductor structure including a substrate, multiple first pads, and multiple second pads is provided. The first pads are disposed on the substrate and are separated from each other. The second pads are disposed on the substrate and are separated from each other. Each of the first pads and each of the second pads are separated from each other. A top-view shape of the each of the first pads is different from a top-view shape of the each of the second pads. A portion of the first pads surrounds the same second pad.