The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jan. 25, 2022
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Kunihiko Tsuchiya, Hamamatsu, JP;

Satoshi Arano, Hamamatsu, JP;

Kenichi Ohtsuka, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0625 (2013.01);
Abstract

A film thickness measurement apparatus includes a light source that irradiates a sample with light, an area sensor that detects light from the sample and outputs a signal according to luminance information of the detected light, a spectrometer that spectrally detects light from the sample and outputs a signal according to wavelength information including a spectrum of the light, and a control apparatus that estimates a film thickness of the sample on the basis of the luminance information specified from the signal output from the area sensor and the wavelength information specified from the signal output from the spectrometer.


Find Patent Forward Citations

Tsuchiya, Kunihiko. (2026). Film thickness measurement device and film thickness measurement method (U.S. Patent No. 12736327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12736327

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…