The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jul. 19, 2023
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/12 (2006.01); C08F 222/06 (2006.01); C08J 5/24 (2006.01); C08L 65/00 (2006.01);
U.S. Cl.
CPC ...
C08G 73/127 (2013.01); C08F 222/06 (2013.01); C08J 5/244 (2021.05); C08L 65/00 (2013.01); C08G 2170/00 (2013.01); C08L 2203/16 (2013.01); C08L 2203/206 (2013.01);
Abstract
Provided is a resin composition capable of being turned into a cured product having a high glass-transition temperature and excellent dielectric properties as well. The resin composition is a heat-curable bismaleimide resin composition containing:
Iwasaki, Masayuki. (2026). Heat-curable bismaleimide resin composition (U.S. Patent No. 12735535). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12735535
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile