The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Apr. 11, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a substrate including a redistribution member having a first surface and a second surface, opposing each other, and including pad structures disposed on the first surface and a redistribution layer electrically connected to the pad structures, an interconnect chip disposed on the second surface of the redistribution member and including an interconnect circuit electrically connected to the redistribution layer, a via structure disposed around the interconnect chip and electrically connected to the redistribution layer, an encapsulant encapsulating at least a portion of each of the interconnect chip and the via structure, and bump structures disposed on the encapsulant; and a first chip structure and a second chip structure disposed on the first surface of the redistribution member and electrically connected to the pad structures.