The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Feb. 07, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Hao Yang, New Taipei City, TW;
Sung-Hsun Wu, Kaohsiung, TW;
Neng-Jye Yang, Hsinchu, TW;
Jye-Yen Cheng, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H10W 20/00 (2026.01); H10W 20/42 (2026.01); H10W 20/41 (2026.01); H10W 20/44 (2026.01);
U.S. Cl.
CPC ...
H10W 20/056 (2026.01); H10W 20/033 (2026.01); H10W 20/077 (2026.01); H10W 20/42 (2026.01); H10W 20/425 (2026.01); H10W 20/4441 (2026.01);
Abstract
Devices with metal structures formed with seams and methods of fabrication are provided. An exemplary method includes forming a metal plug having a top surface formed with a seam; depositing a film over the top surface of the metal plug and at least partially filling the seam; and etching the film from over the metal plug, wherein the film remains in the seam.