The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Oct. 03, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Christopher Netzband, Albany, NY (US);
Adam Gildea, Albany, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01); H10P 10/00 (2026.01); H10P 72/00 (2026.01); H10P 72/78 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7616 (2026.01); H10P 10/128 (2026.01); H10P 72/0428 (2026.01); H10P 72/0604 (2026.01); H10P 72/78 (2026.01);
Abstract
Conformal semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a first vacuum pad. The semiconductor chucks can include a second portion exhibiting greater compliance than either of the first portion or a third portion. The semiconductor chucks can include the third portion comprising a second vacuum pad.