The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Aug. 09, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chih Chieh Yeh, Taipei City, TW;
Ming-Shuan Li, Hsinchu County, TW;
Chih-Hung Wang, Hsinchu City, TW;
Zi-Ang Su, Taoyuan County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a first semiconductor layer having an upper portion over a lower portion, a source/drain feature over the upper portion of the first semiconductor layer, a first contact structure under the lower portion of the first semiconductor layer and electrically connected to the lower portion of the first semiconductor layer. The lower portion is more heavily doped with first dopants than the upper portion. The first dopants are of a first conductivity-type. The source/drain feature includes second dopants of a second conductivity-type opposite to the first conductivity-type.