The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jan. 14, 2022
Ebara Corporation, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Keisuke Uchiyama, Tokyo, JP;
Mao Izawa, Tokyo, JP;
Makoto Kashiwagi, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus () includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism () configured to advance a polishing tape () in its longitudinal direction; and at least one polishing head () arranged near a flat portion of the substrate (W), wherein the polishing head () has a fluid pressing structure () configured to press the polishing tape () with fluid against the flat portion of the substrate, and the fluid pressing structure () has a fluid supply port () arranged so as to face a back surface of the polishing tape ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile