The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Oct. 19, 2023
Disco Corporation, Tokyo, JP;
Kazuma Sekiya, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method for dividing a wafer at a peeling layer after forming the peeling layer within the wafer includes a peeling layer forming step of forming a first peeling layer along the side surface of a circular truncated cone and a second peeling layer along the upper surface of the circular truncated cone, a dividing step of dividing the wafer so as to form a thinned wafer that has a first peeling surface exposed by being divided at the first peeling layer and has a second peeling surface exposed by being divided at the second peeling layer, a grinding step of subjecting the second peeling surface to grinding, and a polishing step of subjecting the first peeling surface and the second peeling surface to polishing.