The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Mar. 10, 2023
Tokyo Electron Limited, Tokyo, JP;
H. Jim Fulford, Marianna, FL (US);
Mark I. Gardner, Cedar Creek, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of fabricating a semiconductor device includes forming on a patterned multilayered stack including sacrificial layers alternatingly stacked with channel layers on a substrate, the patterned multilayered stack having opposing sidewalls and opposing ends. Cantilever supports are formed on the substrate, each cantilever support being in contact with a respective opposing end of the patterned multilayered stack. A gate-all-around (GAA) structure is formed around each channel layer while the opposing ends of the multilayered stack are supported by the cantilever supports. The cantilever supports are removed from the opposing ends of the patterned multilayered stack to expose end portions of each channel layer, and source-drain (S-D) regions are formed on the exposed end portions of each respective channel layer.