The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Sep. 22, 2023
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Sankaranarayanan Ravi, Santa Clara, CA (US);
Alvaro Garcia, Mountain View, CA (US);
Martin Perez Guzman, Santa Clara, CA (US);
Stephen D. Prouty, San Jose, CA (US);
Andreas Schmid, Meyriez, CH;
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H10P 72/722 (2026.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01);
Abstract
A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.