The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jan. 16, 2025
Volantis Semiconductor, Inc., Portland, OR (US);
Tapabrata Ghosh, Oakland, CA (US);
Kevin Nan Lam, Pleasanton, CA (US);
Volantis Semiconductor, Inc., Portland, OR (US);
Abstract
Techniques for power delivery are disclosed. A wafer-scale silicon interposer (WSSI) is accessed. A front side of the WSSI is bonded to a plurality of functional chips. The WSSI includes a plurality of through-silicon vias (TSVs). A plurality of modular power substrates (MPSs) is connected mechanically to a unified control board (UCB). The UCB includes a plurality of DC-to-DC power converters. The plurality of MPSs is attached to a back side of the WSSI. The attaching is based on a plurality of compression connectors. The attaching is based on a compression force from the UCB. The attaching couples each MPS to one or more functional chips within the plurality of functional chips. DC power is sent, by the UCB, to the plurality of functional chips. The sending is based on the plurality of DC-to-DC power converters, the plurality of MPSs, and the plurality of TSVs.