The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jan. 05, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hayato Tanoue, Kikuchi-gun, JP;

Kento Araki, Kikuchi-gun, JP;

Yohei Yamashita, Kikuchi-gun, JP;

Gousuke Shiraishi, Kikuchi-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 74/20 (2026.01); B23K 26/00 (2014.01); B23K 26/035 (2014.01); B23K 26/046 (2014.01); B23K 26/08 (2014.01); B23K 26/50 (2014.01); B23K 103/00 (2006.01); H10P 56/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/203 (2026.01); B23K 26/035 (2015.10); B23K 26/048 (2013.01); B23K 26/0823 (2013.01); B23K 26/083 (2013.01); H10P 56/00 (2026.01); B23K 26/0006 (2013.01); B23K 26/50 (2015.10); B23K 2103/56 (2018.08);
Abstract

A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light to a laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the laser radiating unit relative to each other; and a controller configured to control the laser radiating unit and the moving mechanism. The controller performs, based on a thickness of the laser absorbing film, a control of selecting a position of a separation surface between the first substrate and the second substrate from one of a position between the first substrate and the laser absorbing film or a position between the a separation facilitating film and the second substrate.


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