The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jul. 22, 2022
Tokyo Electron Limited, Tokyo, JP;
Gentaro Goshi, Koshi, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A substrate processing method performed in a substrate processing apparatus configured to process a substrate by bringing the substrate into contact with a processing fluid in a supercritical state is provided. The substrate processing apparatus includes: a processing vessel having a processing space; a main supply line configured to supply the processing fluid to the processing space; a discharge line having a first opening/closing valve, the discharge line being configured to discharge the processing fluid from the processing space; and a bypass line branched off from the main supply line at a branch point, the bypass line joining the discharge line at a junction point downstream of the first opening/closing valve. The substrate processing method includes: increasing a pressure of the processing space up to a preset processing pressure; and maintaining, after the increasing of the pressure, the pressure of the processing space at the processing pressure.