The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Feb. 15, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Han-Yu Chen, Hsinchu County, TW;

Chang-Chih Huang, Taiwan, TW;

Yu-Wen Wang, Taichung City, TW;

Yi-Han Cheng, Tainan City, TW;

Kuo-Chyuan Tzeng, Chu-Pei city, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10N 70/8613 (2023.02); H10N 70/231 (2023.02); H10N 70/8828 (2023.02);
Abstract

A phase-change material switch may include a first interconnect-level dielectric, a heat spreader formed within the first interconnect-level dielectric, a second interconnect-level dielectric formed over the heat spreader, a phase change material element formed in or over the second interconnect-level dielectric, a first electrode and a second electrode in electrically conductive contact with the phase change material element, and a heating element coupled to the phase change material element and configured to supply a heat pulse to the phase change material element. The heat spreader may be located proximate to a first one of the phase change material element and the heating element, and the heat spreader may be smaller than the phase change material element. The heat spreader may be form using materials and processes similar to those used to form electrical interconnects, but unlike electrical interconnects, the heat spreader may be electrically isolated from electrical interconnects.


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