The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Aug. 08, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yen Lin Chung, Hsinchu, TW;
Kao-Cheng Lin, Hsinchu, TW;
Wei-Cheng Wu, Hsinchu, TW;
Pei-Yuan Li, Hsinchu, TW;
Chien-Chen Lin, Hsinchu, TW;
Chun-Tse Chou, Hsinchu, TW;
Chien Hui Huang, Hsinchu, TW;
Yung-Ning Tu, Hsinchu, TW;
Shang Lin Wu, Hsinchu, TW;
Chia-Che Chung, Hsinchu, TW;
Chia-Chi Hung, Hsinchu, TW;
Wei Min Chan, Hsinchu, TW;
Yen-Huei Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit (IC) device includes a plurality of memory segments. Each memory segment includes a plurality of memory cells, and a local bit line electrically coupled to the plurality of memory cells and arranged on a first side of the IC device. The IC device further includes a global bit line electrically coupled to the plurality of memory segments, and arranged on a second side of the IC device. The second side is opposite the first side in a thickness direction of the IC device.