The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jun. 30, 2022
Intel Corporation, Santa Clara, CA (US);
William Blanton, Cornelius, OR (US);
Deepak Selvanathan, Portland, OR (US);
Shakul Tandon, Portland, OR (US);
Martin N. Weiss, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include semiconductor die with overlay marks, electronic devices that include semiconductor dies with overlay marks, and methods of measuring overlay. In one embodiment, a semiconductor die includes multiple overlay marks, including a first overlay mark and a second overlay mark. The first overlay mark is at a first position on the semiconductor die and includes a first set of patterns with a first orientation. The second overlay mark is at a second position on the semiconductor die and includes a second set of patterns with a second orientation. The first position of the first mark and the second position of the second mark are non-overlapping. In addition, the first orientation of the patterns in the first mark is substantially orthogonal to the second orientation of the patterns in the second mark.